Matt is qualified to use this O2 plasma machine. It etch S1813 Photoresist at approximately 100 nm/s. A typical recipe for ashing (cleaning off photoresist residue after development) is 30 seconds.

McEuen lab has a harrick plasma machine:

http://www.harrickplasma.com/

It's powerful enough the kill nanotubes devices in ONE second. By kill, I mean making NTs no longer conductive. Their 'dead' body may still be on the surface with such a short etching. A longer one may remove everything.

With regard to your plasma application: many of our customers use our plasma cleaners for pre-bonding plasma treatment of PDMS and glass surface in microfluidics applications. For published papers citing the use of our products on PDMS and glass, specifically for use in microfluidics devices, please see our web site.

Please note that if oxygen process gas is used, this in turn necessitates the use of a suitable “oxygen service pump” to avoid the hazardous combination of highly concentrated oxygen and hydrocarbon pump oil. We distribute as special items both Fomblin-based and dry pumps suitable for oxygen service. Let me just give you informal pricing for these items now, and I can fold whatever you would like into a formal quote when appropriate: