photolithography
Differences
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| photolithography [2026/08/13 16:15] – gus | photolithography [2026/08/13 16:18] (current) – gus | ||
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| - Set you spin parameters in the spinner. | - Set you spin parameters in the spinner. | ||
| - | - Blow off your substrates (do this for every layer if you don't have 2D materials on the substrate -Gus) | + | - Blow off your substrates (do this for every layer if you don't have 2D materials on the substrate, I should link an image which shows why! -Gus) |
| - Load your substrate onto the vacuum chuck. Use the largest chuck which does not cover more than ~80% of the bottom of the sample. This helps prevent vacuum leaks or resist being pulled into the vacuum. | - Load your substrate onto the vacuum chuck. Use the largest chuck which does not cover more than ~80% of the bottom of the sample. This helps prevent vacuum leaks or resist being pulled into the vacuum. | ||
| - Cleanly pipette resist onto center of chip. Immediately spin for 45 s. | - Cleanly pipette resist onto center of chip. Immediately spin for 45 s. | ||
photolithography.txt · Last modified: 2026/08/13 16:18 by gus