wirebonding
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| wirebonding [2026/01/29 14:23] – gus | wirebonding [2026/02/18 08:14] (current) – gus | ||
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| The wirebonder manual: | The wirebonder manual: | ||
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| + | As of January 2026, West Bond is no longer operating. Matt Ritchie (who did a service visit Dec '25) started a company and is doing service work on the tools: [[https:// | ||
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| + | ====== Introduction to Wirebonding ====== | ||
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| + | This video give a good introduction: | ||
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| + | https:// | ||
| ====== Wedge bonding Theory ====== | ====== Wedge bonding Theory ====== | ||
| Wedge bonding relies on the application of ultrasonic power and force to bond the wire (bonding wire) to a metal pad (bonding pad). The careful application of both force and ultrasonic power deform the wire and diffuse the wire metal into the pad without weakening the wire too much. The strength of the wire after bonding is shown below as a function of deformation from ultrasonic energy and force applied. | Wedge bonding relies on the application of ultrasonic power and force to bond the wire (bonding wire) to a metal pad (bonding pad). The careful application of both force and ultrasonic power deform the wire and diffuse the wire metal into the pad without weakening the wire too much. The strength of the wire after bonding is shown below as a function of deformation from ultrasonic energy and force applied. | ||
| - | {{wirebonding_optimization.png}} | + | |
| + | {{wirebonding_optimization.png?700}} | ||
| Outside the optimal range, | Outside the optimal range, | ||
| Foot lift: the bond pulls off the pad, meaning the metals didn't have intimate contact. | Foot lift: the bond pulls off the pad, meaning the metals didn't have intimate contact. | ||
| - | {{wirebonding_foot_lift.png}} | + | |
| + | {{wirebonding_foot_lift.png?400}} | ||
| Weak bond: the wire was deformed too much by the bond tool. | Weak bond: the wire was deformed too much by the bond tool. | ||
| - | {{wirebonding_weak_bond.png}} | + | |
| + | {{wirebonding_weak_bond.png?400}} | ||
| The surface quality is also important. While the deformation needs to be managed, clean and properly adhered bond pads are important to successful bonding. | The surface quality is also important. While the deformation needs to be managed, clean and properly adhered bond pads are important to successful bonding. | ||
| Line 56: | Line 68: | ||
| - | The wire should be deformed | + | The wire should be deformed |
| - | {{wirebonding_deformation.jpg}} | + | |
| - | ((maybe I need a new diagram that doesn' | + | {{wirebonding_deformation.jpg? |
| To tune this, do the following: | To tune this, do the following: | ||
wirebonding.1769725403.txt.gz · Last modified: 2026/01/29 14:23 by gus
