Differences

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--- wirebonding [2025/12/11 12:29] – created gus
+++ wirebonding [2026/01/29 14:23] (current) – gus
@@ Line 56: / Line 56: @@
-The wire should be deformed no more than 150% of the original width. See below:
+The wire should be deformed aout 150% of the original width. See below:
-{{wirebonding_top_view.png}}
+{{wirebonding_deformation.jpg}}
 ((maybe I need a new diagram that doesn't cut the BL2))
@@ Line 89: / Line 89: @@
 The wire should come out of the bond tool straight towards you when everything is aligned.
+====== Chip Packages ======
+For chips going into the Cryostat in 308, they must be wirebonded to a [[https://www.spectrum-semi.com/products/sidebraze|Dual In-Line Package (DIP)]]. There are a few steps to prepare:
+  - Cut the chip to size. You can use a razorblade as a shield for the sensitive part of the device while you scribe your substrate.
+  - Clean your package if it was previously used. Cleaning silver paint is a pain, so it can be beneficial to but new packages if we can afford it.
+  - Tack your chip (and maybe a filler chip, see below) to the package using silver paint. The back of a wooden Q-tip is great as it will leave just enough paint to hold the chip, but not make a mess.
+Once dried, you can wirebond.
+==== Filler chips ====
+If you want to focus a laser on your chip while in the cryostat, you'll need to ensure it is tall enough that it can sit in the focal plane of the objective you're using. To help, you can raise your chip up by tacking a "filler chip" in and then tacking your "device" chip on top of that.
 ====== Misc. ======
@@ Line 96: / Line 107: @@
   * The drop before clamp parameter is better left off. When on, when lowering the tool after the first bond, the clamp will engage. This tension can be problematic.
   * The loop height parameter only changes when the tool beeps when raising the bond head. It has no mechanical impact on the bond.